Hyun‐Cheol Bae

Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis

Keon‐Soo Jang, Yong‐Sung Eom, Kwang‐Seong Choi et al. · Journal of Applied Polymer Science · 2018 · 201 citations

Natural Sciences, Materials Engineering, Materials Science +13

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

D. Jung, Youngwoo Kim, Jonghoon J. Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 71 citations

Engineering, Computer Engineering, Electrical Engineering +17

Measurement and Analysis of a High-Speed TSV Channel

Heegon Kim, Jonghyun Cho, Myunghoi Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 60 citations

Engineering, Computer Engineering, Electrical Engineering +16

Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

Yong‐Sung Eom, Jihye Son, Keon‐Soo Jang et al. · ETRI Journal · 2014 · 39 citations · Full text

Engineering, Materials Engineering, Materials Science +16

Collective laser‐assisted bonding process for 3D TSV integration with NCP

Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang et al. · ETRI Journal · 2019 · 32 citations · Full text

Engineering, Materials Engineering, Materials Science +9