Hyun‐Cheol Bae

Statistics

Publications

Citations

607

H-Index

Active since

2012

Affiliations

Electronics and Telecommunications Research Institute(Current)

Korea Advanced Institute of Science and Technology

Hyun‐Cheol Bae is an author at Electronics and Telecommunications Research Institute specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMicroelectronicsElectrical EngineeringMicrofabrication3D PrintingApplied PhysicsAdvanced PackagingMaterials Engineering

Publications per year

2012–2019

Publications

Synchronous curable deoxidizing capability of epoxy–anhydride adhesive: Deoxidation quantification via spectroscopic analysis

Keon‐Soo Jang, Yong‐Sung Eom, Kwang‐Seong Choi et al. · Journal of Applied Polymer Science · 2018 · 201 citations

Macromolecular Chemistry, Engineering, Chemistry +18

Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

D. Jung, Youngwoo Kim, Jonghoon J. Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2016 · 67 citations

Materials Engineering, Silicon Via, Electrical Engineering +15

Measurement and Analysis of a High-Speed TSV Channel

Heegon Kim, Jonghyun Cho, Myunghoi Kim et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2012 · 60 citations

Channel Modeling, Channel Losses, Electrical Engineering +15

Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

Yong‐Sung Eom, Jihye Son, Keon‐Soo Jang et al. · ETRI Journal · 2014 · 39 citations · Full text

Engineering, Fuel Science, Long Pot Life +16

Collective laser‐assisted bonding process for 3D TSV integration with NCP

Wagno Alves Braganca, Yong‐Sung Eom, Keon‐Soo Jang et al. · ETRI Journal · 2019 · 32 citations · Full text

Tsv Integration, Engineering, Mechanical Engineering +17

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