Role of cerium in microstructure and corrosion properties of Sn-1.0Ag solder alloys

Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds · 2003 · 610 citations

Natural Sciences, Materials Engineering, Materials Science +11

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 290 citations

Natural Sciences, Materials Engineering, Materials Science +11

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Bart Vandevelde, Mario González, Paresh Limaye et al. · Microelectronics Reliability · 2006 · 120 citations

Engineering, Materials Engineering, Materials Science +14

The wettability and microstructure of Sn-Zn-RE alloys

Chi‐Man Lawrence Wu, C. Law, Daquan Yu et al. · Journal of Electronic Materials · 2003 · 114 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of rare earth element additions on the microstructure and mechanical properties of tin-silver-bismuth solder

Zhidong Xia, Zhi‐Gang Chen, Nan Mu et al. · Journal of Electronic Materials · 2002 · 89 citations

Natural Sciences, Materials Engineering, Materials Science +16