Precision 3D profile in-line measurement of through-silicon via (TSV) based on high-frequency spectrum signals in the pupil plane

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J. Gambino, Shawn A. Adderly, John Knickerbocker · Microelectronic Engineering · 2015 · 307 citations

Engineering, Electrical Engineering, Manufacturing Engineering +14

Integration challenges of copper Through Silicon Via (TSV) metallization for 3D-stacked IC integration

J. Van Olmen, Cedric Huyghebaert, Jan Coenen et al. · Microelectronic Engineering · 2010 · 79 citations

Engineering, Materials Engineering, Materials Science +16

Electromagnetic analysis of diffraction gratings by the finite-difference time-domain method

Hiroyuki Ichikawa · Journal of the Optical Society of America A · 1998 · 79 citations

Natural Sciences, Electrical Engineering, Computational Electromagnetics +16

Overview Of Scatterometry Applications In High Volume Silicon Manufacturing

Christopher J. Raymond · AIP conference proceedings · 2005 · 75 citations

Engineering, Manufacturing Engineering, Materials Engineering +17

Fabrication of 3D packaging TSV using DRIE

M. Puech, J. M. Thevenoud, J. M. Gruffat et al. · 2008 · 67 citations · Full text

Engineering, Electrical Engineering, Materials Science +17