Statistics
Publications
1
Citations
67
H-Index
1
Active since
2008
J. M. Thevenoud is an author specializing in packaging engineering, cmos image sensors, and materials science.
Publications per year
2008–2008
1
1
Fabrication of 3D packaging TSV using DRIE
M. Puech, J. M. Thevenoud, J. M. Gruffat et al. · 2008 · 67 citations · Full text
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