IEEE Transactions on Electromagnetic Compatibility · 2018 · 12 citations · 11 references
EngineeringComputer EngineeringElectrical EngineeringMicroelectronicsStatistical ModelingSystem-on-chip DesignDevice CharacterizationDevice ReliabilityElectromagnetic CompatibilityIntegrated Circuit DesignReliability ModelingSemiconductor ReliabilityAging CharacterizationAging Degradation AnalysisConducted EmissionsElectromigration AnalysisReliability SimulationSystem Reliability Modeling
Electromagnetic compatibility (EMC) of integrated circuits (ICs) represents a major constraint for the qualification of electronic circuits. Today, there exist standardized models such as integrated circuit emission model for conducted emissions (ICEM-CE) that allows the prediction of conducted emission generated by an IC at a printed circuit board (PCB) level. However, the EMC levels may change after a certain period of operation due to the aging of components. On the other hand, no existing model or tool can predict the long-term EMC levels. This paper presents a new methodology for modeling of ICs in order to construct an EMC model, which takes into account the aging based on a new reliability model called MultiphySics mulTistressOrs predictive Reliability Model (M-STORM).
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Electronic circuit reliability modeling
J.B. Bernstein, Moshe Gurfinkel, Xiaojun Li et al. · Microelectronics Reliability · 2006 · 168 citations
Engineering, Computer Engineering, Electrical Engineering +12
A thorough investigation of MOSFETs NBTI degradation
V. Huard, M. Denais, F. Perrier et al. · Microelectronics Reliability · 2004 · 150 citations
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Scaled CMOS Technology Reliability Users Guide
Mark White · 2014 · 42 citations · Full text
Engineering, Computer Engineering, Electrical Engineering +17