Investigation on the effects of low-temperature anodic bonding and its reliability for MEMS packaging using destructive and non-destructive techniques

Field Assisted Glass-Metal Sealing

George Wallis, D. Pomerantz · Journal of Applied Physics · 1969 · 730 citations

Natural Sciences, Materials Engineering, Materials Science +7

Micromachined pressure sensors: review and recent developments

William P. Eaton, James H. Smith · Smart Materials and Structures · 1997 · 583 citations · Full text

Engineering, Materials Science, Mechanical Engineering +17

Wafer direct bonding: tailoring adhesion between brittle materials

A. Plößl · Materials Science and Engineering R Reports · 1999 · 350 citations

Engineering, Materials Engineering, Materials Science +11

Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors

Tony Rogers, Jan Kowal · Sensors and Actuators A Physical · 1995 · 187 citations

Engineering, Materials Engineering, Materials Science +16

Low temperature wafer anodic bonding

Jun Wei, Hua Xie, Mui Ling Sharon Nai et al. · Journal of Micromechanics and Microengineering · 2003 · 140 citations

Natural Sciences, Materials Engineering, Materials Science +15