Concepedia

Anodic Bonding

Anodic Bonding is a wafer bonding technique that belongs to the class of field-assisted bonding methods, distinguished by the application of an electric field and elevated temperature to enable the electrostatic migration of alkali ions—typically sodium—in a glass substrate toward the cathode, thereby creating a strong, hermetic seal between the glass and a semiconductor or metal surface.

363

Publications

14.1K

Citations

1.3K

Authors

350

Institutions

Publications per year

2017–2026

43

Variants

Electrostatic Bonding

Parents

Publications

363

Wafer-to-wafer bonding for microstructure formation

Martin A. Schmidt · Proceedings of the IEEE · 1998 · 429 citations

, , +14

Ultrasonic micromixer for microfluidic systems

Zhen Yang, Sohei Matsumoto, Hiroshi Goto et al. · Sensors and Actuators A Physical · 2001 · 417 citations

, , +16

Microfabricated alkali atom vapor cells

Li‐Anne Liew, Svenja Knappe, John Moreland et al. · Applied Physics Letters · 2004 · 370 citations

, , +13

Millipede-inspired structural design principle for high performance polysaccharide binders in silicon anodes

You Kyeong Jeong, TaeWoo Kwon, Inhwa Lee et al. · Energy & Environmental Science · 2015 · 267 citations

, , +13

Fabrication and characterization of 20 nm planar nanofluidic channels by glass–glass and glass–silicon bonding

Pan Mao, Jongyoon Han · Lab on a Chip · 2005 · 245 citations

, , +17

1–5 of 363

Authors

1.3K

  1. FY
    F. Yalcın Yamaner

    North Carolina State University, United States

    9 publications · 279 citations

    9

    h-index

  2. ME
    Masayoshi Esashi

    Tohoku University, Japan

    9 publications · 698 citations

    9

    h-index

  3. ÖO
    Ömer Oralkan

    Stanford University, United States

    8 publications · 244 citations

    8

    h-index

  4. XZ
    Xiao Zhang

    North Carolina State University, United States

    8 publications · 244 citations

    8

    h-index

  5. AH
    A. Hanneborg

    SINTEF, Norway

    8 publications · 219 citations

    8

    h-index

1–5 of 1.3K

Institutions

350

  1. Tohoku University

    Sendai, Japan

    14 h-index

    39 publications

    2.8K citations

  2. Centre National de la Recherche Scientifique

    Paris, France

    13 h-index

    71 publications

    3K citations

  3. University of Michigan

    Ann Arbor, United States

    9 h-index

    22 publications

    1.4K citations

  4. North Carolina State University

    Raleigh, United States

    8 h-index

    29 publications

    823 citations

  5. Chinese Academy of Sciences

    Beijing, China

    8 h-index

    38 publications

    613 citations

  6. SINTEF

    Trondheim, Norway

    7 h-index

    20 publications

    371 citations

  7. University of Twente

    Enschede, The Netherlands

    7 h-index

    25 publications

    991 citations

  8. Korea Institute of Science and Technology

    Seoul, South Korea

    7 h-index

    24 publications

    586 citations

1–8 of 350

Venues

  1. Journal of Micromechanics and Microengineering

    JMM · 44 publications · 1.4K citations

    23

    h-index

  2. Journal of Microelectromechanical Systems

    23 publications · 1.5K citations

    20

    h-index

  3. Sensors and Actuators A Physical

    32 publications · 1.9K citations

    19

    h-index

  4. Journal of The Electrochemical Society

    JES · 12 publications · 366 citations

    10

    h-index

  5. 9

    h-index

1–5