IEEE Transactions on Microwave Theory and Techniques · 2017 · 115 citations · 34 references
EngineeringElectrical EngineeringHeat TransferMicroelectronicsSemiconductor DevicesDevice ModelingHeat ConductionHeat Transfer AnalysisHeat Transfer ModelingPower DissipationThermal Properties Of SemiconductorsElectro-thermal ModelingGallium Nitride (Gan) MaterialsGallium Nitride Power AmplifiersGan-based High-frequency DevicesLarge-signal Device ModelingLarge-signal ModelingLarge-signal Power TransferScalability
A scalable electrothermal large-signal AlGaN/GaN HEMTs model for both fundamental and multiharmonics is presented based on the modified Angelov model. To obtain accurate scalability of the electrothermal model, a simple empirical expression is proposed for the geometric and power-dissipation-dependent nonlinear thermal resistance R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">th</sub> . Only one additional parameter with linear scaling rule is needed in the drain-source current (I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ds</sub> ) model for a scalable large-signal multiharmonic model. The proposed model has been validated by different AlGaN/GaN HEMTs characterized by on-wafer measurements. It shows that the presented scalable model can well predict the dc I-V, pulsed I-V, scattering (S) parameters, and large-signal performance up to third harmonic. Furthermore, to further validation, a C-band power amplifier is designed. The amplifier is realized using the second-harmonic tuned approach to enhance the efficiency. Measurement results show that the GaN high power amplifier (HPA) microwave monolithic integrated circuit (MMIC) exhibits more than 40% power-added efficiency and 60-W output power (P <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">out</sub> ) with associated gain of 25 dB in 5-6 GHz measured at 28-V drain voltage and pulse signal with 100-μs pulsewidth and 10% duty cycle. The area of the chip is 3.2 mm × 5.3 mm (16.96 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ). These results show that the proposed model will be useful for high-efficiency HPA MMIC design.
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GaN-Based RF Power Devices and Amplifiers
Umesh K. Mishra, Likun Shen, T.E. Kazior et al. · Proceedings of the IEEE · 2008 · 1.8K citations
40-W/mm Double Field-plated GaN HEMTs
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