Publication | Closed Access
Defect passivation with fluorine in a Ta/sub x/C/ high-K gate stack for enhanced device threshold voltage stability and performance
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Citations
2
References
2006
Year
Unknown Venue
EngineeringVlsi DesignGate Stack DeviceEnhanced DeviceSemiconductor DeviceNanoelectronicsElectronic PackagingVoltage StabilityElectrical EngineeringBias Temperature InstabilityTime-dependent Dielectric BreakdownThreshold Voltage InstabilitySingle Event EffectsSemiconductor Device FabricationBulk SiMicroelectronicsStress-induced Leakage CurrentApplied PhysicsDefect PassivationBeyond Cmos
Using a novel fluorinated Ta <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">y</sub> /high-k gate stack, we show breakthrough device reliability and performance improvements. This is a critical result since threshold voltage instability may be a fundamental problem and performance degradation for high-k is a concern. The novel fluorinated gate stack device exceeds the PBTI and NBTI targets with sufficient margin and has electron mobility comparable to the best polySi/SiON device on bulk Si reported so far
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