2002 · 27 citations · 7 references
EngineeringElectrical EngineeringMechanical EngineeringHeat TransferMicroelectronicsSemiconductor DevicesCooling SystemsIntegrated Circuit DesignMicrofabrication ProcessesMicrofluidicsThermal DesignThermal ManagementHeat SinksMicrochannel CoolingMicrochannel DesignMicrochannel Heat TransferSiliconSilicon MicrochannelsThermal CharacteristicsThermal Dissipation
The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. Thermal dissipation characteristics are calculated for several microchannels geometry. An optimised structure is proposed and its technological realisation is described.
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Bonding of silicon wafers for silicon-on-insulator
W. Maszara, Georges Goetz, A.L. Caviglia et al. · Journal of Applied Physics · 1988 · 861 citations
Wafer bonding for silicon-on-insulator technologies
J. B. Lasky · Applied Physics Letters · 1986 · 574 citations