C. Schaeffer

Analytic modeling, optimization, and realization of cooling devices in silicon technology

M. Coyaud, C. Schaeffer, J. Boussey et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 52 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Design, fabrication and test of silicon heat pipes with radial microcapillary grooves

M. Ivanova, A. Lai, C. Gillot et al. · 2006 · 32 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

On the use of flat heat pipes as thermal spreaders in power electronics cooling

Yvan Avenas, C. Gillot, A. Bricard et al. · 2003 · 30 citations

Engineering, Electrical Engineering, Materials Science +17

Microchannel integrated heat sinks in silicon technology

C. Perret, C. Schaeffer, J. Boussey · 2002 · 27 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Thermal analysis of thermal spreaders used in power electronics cooling

Yvan Avenas, M. Ivanova, N. V. Popova et al. · Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344) · 2003 · 22 citations

Engineering, Electrical Engineering, Mechanical Engineering +17