Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging

Soldering in electronics

G.W.A.D. · Microelectronics Reliability · 1990 · 289 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +4

Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term aging

S. Choi, Thomas R. Bieler, J. P. Lucas et al. · Journal of Electronic Materials · 1999 · 215 citations

Materials Science, Materials Engineering, Sn-pb Eutectic Solders +10

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Iver E. Anderson · Journal of Materials Science Materials in Electronics · 2006 · 208 citations

Materials Science, Materials Engineering, Electrical Engineering +4

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

L.C. Tsao, Shih‐Ying Chang, Chih-Chen Lee et al. · Materials & Design (1980-2015) · 2010 · 205 citations

Materials Science, Materials Engineering, Engineering +10

Ag₃Sn plate formation in the solidification of near ternary eutectic Sn–Ag–Cu alloys

Donald W. Henderson, Timothy Gosselin, Amit Sarkhel et al. · Journal of materials research/Pratt's guide to venture capital sources · 2002 · 198 citations

Materials Engineering, Materials Science, Engineering +6