Chemical Vapor Deposition of Copper for IC Metallization: Precursor Chemistry and Molecular Structure

Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects

F. B. Kaufman, Daniel B. Thompson, R. E. Broadie et al. · Journal of The Electrochemical Society · 1991 · 506 citations

Engineering, Mechanical Engineering, Chip Interconnects +19

Oxidation and protection in copper and copper alloy thin films

Jian Li, J. W. Mayer, E. G. Colgan · Journal of Applied Physics · 1991 · 253 citations

Materials Science, Materials Engineering, Chemical Engineering +14

Advanced multilayer metallization schemes with copper as interconnection metal

S. P. Murarka, R.J. Gutmann, Alain E. Kaloyeros et al. · Thin Solid Films · 1993 · 245 citations

Materials Science, Materials Engineering, Engineering +5

Mechanistic Studies of Chemical Vapor Deposition

Joseph M. Jasinski, B.S. Meyerson, B. A. Scott · Annual Review of Physical Chemistry · 1987 · 230 citations

Engineering, Machine Learning, Machine Learning Tool +19

Silicon chemical vapor deposition one step at a time: fundamental studies of silicon hydride chemistry

Joseph M. Jasinski, S. M. Gates · Accounts of Chemical Research · 1991 · 220 citations

Engineering, Chemical Analysis, Altmetric Attention Score +17