Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect

Interstitial Diffusion of Copper in Tin

B. F. Dyson, T. R. Anthony, David Turnbull · Journal of Applied Physics · 1967 · 378 citations

Materials Engineering, Materials Science, Engineering +6

The Cu-Sn (Copper-Tin) system

Nigel J. Saunders, A. P. Miodownik · Bulletin of Alloy Phase Diagrams · 1990 · 322 citations

Materials Science, Materials Engineering, Engineering +4

Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples

H. Gan, K. N. Tu · Journal of Applied Physics · 2005 · 264 citations · Full text

Engineering, Imc Formation, Cu Electrodes +16

Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders

Minhua Lu, Da‐Yuan Shih, Paul Lauro et al. · Applied Physics Letters · 2008 · 246 citations

Materials Engineering, Materials Science, Electrical Engineering +13

Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin

D. C. Yeh, H. B. Huntington · Physical Review Letters · 1984 · 185 citations

Materials Science, Engineering, Diffusion Resistance +13