Zhouxiaolong Zhang

Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

Mingliang Huang, Jie Zhao, Zhouxiaolong Zhang et al. · Acta Materialia · 2015 · 99 citations

Materials Science, Sn-3.0ag-0.5cu Flip Chip, Electromigration Technique +7

Mechanical properties of hot-pressed Al2O3/SiC composites

Xiaofei Shi, Fumin Xu, Zhouxiaolong Zhang et al. · Materials Science and Engineering A · 2010 · 87 citations

Materials Science, Engineering, Mechanical Properties +4

Dominant effect of high anisotropy in β-Sn grain on electromigration-induced failure mechanism in Sn-3.0Ag-0.5Cu interconnect

Mingliang Huang, J. Zhao, Zhouxiaolong Zhang et al. · Journal of Alloys and Compounds · 2016 · 53 citations

Materials Science, Electrical Engineering, Material Analysis +8

In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction

Mingliang Huang, Fan Yang, Ning Zhao et al. · Materials Letters · 2014 · 34 citations

Materials Science, Materials Engineering, Interfacial Process +11

In situ study on reverse polarity effect in Cu/Sn–9Zn/Ni interconnect undergoing liquid–solid electromigration

Mingliang Huang, Zhouxiaolong Zhang, Ning Zhao et al. · Journal of Alloys and Compounds · 2014 · 24 citations

Materials Science, Electrical Engineering, Electromigration Technique +7