Ning Zhao

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

Ning Zhao, Yi Zhong, Mingliang Huang et al. · Scientific Reports · 2015 · 149 citations · Full text

Engineering, Materials Engineering, Materials Science +17

Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

Mingliang Huang, Jie Zhao, Zhouxiaolong Zhang et al. · Acta Materialia · 2015 · 103 citations

Natural Sciences, Materials Engineering, Materials Science +14

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Yuanyuan Qiao, Haitao Ma, Fengyun Yu et al. · Acta Materialia · 2021 · 97 citations

Engineering, Materials Engineering, Materials Science +16

In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction

Lin Qu, Ning Zhao, Huijing Zhao et al. · Scripta Materialia · 2013 · 91 citations

Natural Sciences, Materials Engineering, Materials Science +15

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

Haitao Ma, Lin Qu, Mingliang Huang et al. · Journal of Alloys and Compounds · 2012 · 63 citations

Natural Sciences, Materials Engineering, Materials Science +9