Ning Zhao

Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient

Ning Zhao, Yi Zhong, Mingliang Huang et al. · Scientific Reports · 2015 · 146 citations · Full text

Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration

Mingliang Huang, Jie Zhao, Zhouxiaolong Zhang et al. · Acta Materialia · 2015 · 99 citations

Materials Science, Sn-3.0ag-0.5cu Flip Chip, Electromigration Technique +7

In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction

Lin Qu, Ning Zhao, Huijing Zhao et al. · Scripta Materialia · 2013 · 91 citations

Materials Science, Materials Engineering, Real-time Growth Behavior +11

Quasi-in-situ observation on diffusion anisotropy dominated asymmetrical growth of Cu-Sn IMCs under temperature gradient

Yuanyuan Qiao, Haitao Ma, Fengyun Yu et al. · Acta Materialia · 2021 · 91 citations

Materials Science, Cu-sn Imcs, Engineering +11

In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology

Haitao Ma, Lin Qu, Mingliang Huang et al. · Journal of Alloys and Compounds · 2012 · 63 citations

Materials Engineering, Materials Science, In-situ Study +4