In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction

Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening

H. K. Kim, K. N. Tu · Physical review. B, Condensed matter · 1996 · 501 citations

Engineering, Materials Engineering, Materials Science +14

Theory for intermetallic phase growth between cu and liquid Sn-Pb solder based on grain boundary diffusion control

Matt Schaefer, R.A. Fournelle, Jin Liang · Journal of Electronic Materials · 1998 · 327 citations

Natural Sciences, Materials Engineering, Materials Science +14

Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

Hua Zou, H.J. Yang, Z.F. Zhang · Acta Materialia · 2008 · 202 citations

Engineering, Materials Engineering, Materials Science +16

Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

Jianfeng Li, Pearl Agyakwa, C. Mark Johnson · Acta Materialia · 2010 · 177 citations

Natural Sciences, Materials Engineering, Materials Science +14

Scallop formation and dissolution of Cu–Sn intermetallic compound during solder reflow

Dejian Ma, W. D. Wang, S. K. Lahiri · Journal of Applied Physics · 2002 · 143 citations

Natural Sciences, Materials Engineering, Materials Science +13