Publication | Closed Access
In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction
91
Citations
12
References
2013
Year
Materials ScienceMaterials EngineeringReal-time Growth BehaviorEngineeringPowder MetallurgyCorrosionSitu StudySoldering ReactionApplied PhysicsMetallurgical InteractionMetallurgical ProcessMetallurgical SystemMicrostructureMetal Processing
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