Natural SciencesMaterials EngineeringMaterials ScienceMechanical Behavior Of MaterialsMicrofabricationStructural MaterialsCompressive PropertiesMicrofabrication MaterialsPlastic DeformationSilicon MaterialsThin Film Mechanical PropertiesAnnealingIntrinsic StressLow-stress FilmsPolysiliconPolysilicon ProcessingSilicon DiaphragmsStress Engineering In Thin Films
The sacrificial etch technology for fabricating free-standing three-dimensional microstructures in polysilicon has been successfully implemented. A variety of techniques for reducing the intrinsic compressive stress have been employed in fabricating low stress structures. Low-temperature-deposited microcrystalline polysilicon and polysilicon deposited over doped oxide were found to have low intrinsic stress, without additional annealing. A simple technique for obtaining additional compliance in diaphragms is described. Anisotropically etched submicron fibers and plastically deformed polysilicon shells are some of the unusual devices that have been obtained.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Fabrication techniques for integrated sensor microstructures
H. Guckel, D.W. Burns · 1986 · 29 citations