IEEE Transactions on Industry Applications · 1986 · 21 citations · 8 references
Electrical EngineeringEngineeringNanoelectronicsBias Temperature InstabilityMechanical EngineeringStructural TopologyPower Semiconductor DeviceStructural DesignInsulated Gate TransistorStructural OptimizationNpt IgtStructural MechanicsMicroelectronicsStructural SteelPunch-through IgtNon-punch-through Igt StructuresStructural EngineeringSemiconductor Device
The insulated gate transistor (IGT) has been modeled as a wide-base bipolar junction transistor (BJT) driven by a MOSFET. Therefore, the vertical wide-base BJT structure influences the following IGT characteristics: 1) the forward current-voltage characteristics, 2) the fall time/forward-voltage drop trade-offs, 3) the high-temperature blocking, and 4) the turn-off current tail. An IGT with punch-through (PT) BJT yields lower forward voltage than that of an IGT with non-punch-through (NPT) BJT due to the thinner base of the PT BJT structure. The punch-through IGT has lower off-state (leakage) current and also shorter turn-off current tail due to lower current gain of a PT BJT than that of an NPT BJT. Both PT and NPT IGT's have large safe operation areas.
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The insulated gate rectifier (IGR): A new power switching device
B. Jayant Baliga, M.S. Adler, P. Gray et al. · 1982 · 199 citations
Electrical Engineering, Engineering, Insulated Gate Rectifier +12
Suppressing latchup in insulated gate transistors
B. Jayant Baliga, M.S. Adler, P. Gray et al. · IEEE Electron Device Letters · 1984 · 52 citations