2014 · 20 citations · 11 references
EngineeringElectrical EngineeringMicroelectronicsPower ElectronicsSemiconductor DevicesDevice CharacterizationDevice ReliabilityElectrical System DiagnosticsElectrical System TestingSemiconductor ReliabilityThermal ManagementAccelerated Ageing TestAging CharacterizationAging Degradation AnalysisOnline MonitoringPower Device ReliabilityPower Electronics ValidationReliability Analysis Of Power ElectronicsReliability Of Power Electronic Systems
Several accelerated test methods exist in order to study the failures mechanisms of the high power IGBT modules like temperature cycling test or power cycles based on DC current pulses. The main drawback is that the test conditions do not represent the real performance and stress conditions of the device in real application. The hypothesis is that ageing of power modules closer to real environment including cooling system, full dc-link voltage and continuous PWM operation could lead to more accurate study of failure mechanism. A new type of test setup is proposed, which can create different real load conditions like in the field. Furthermore, collector-emitter voltage (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ce</sub> ) has been used as indicator of the wear-out of the high power IGBT module. The innovative monitoring system implemented in the test setup is capable of measure the V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ce</sub> and forward voltage of the antiparallel diode (V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">f</sub> ) during converter operation, which is also demonstrated.
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Vanessa Smet, François Forest, Jean-Jacques Huselstein et al. · IEEE Transactions on Industrial Electronics · 2012 · 224 citations · Full text
Laurent Dupont, Yvan Avenas, Pierre‐Olivier Jeannin · IEEE Transactions on Industry Applications · 2013 · 215 citations · Full text