Pierre‐Olivier Jeannin

Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters

Laurent Dupont, Yvan Avenas, Pierre‐Olivier Jeannin · IEEE Transactions on Industry Applications · 2013 · 215 citations · Full text

Engineering, Electrical Engineering, Microelectronics +16

SIC power devices in power electronics: An overview

Luciano F. S. Alves, Ruan C. M. Gomes, Pierre Lefranc et al. · 2017 · 103 citations

Engineering, Electrical Engineering, Materials Science +17

High frequency DC-DC converter using GaN device

Johan Delaine, Pierre‐Olivier Jeannin, David Frey et al. · 2012 · 90 citations

Engineering, Electrical Engineering, Microelectronics +16

Diamond semiconductor performances in power electronics applications

Gaëtan Perez, Aurélien Maréchal, Gauthier Chicot et al. · Diamond and Related Materials · 2020 · 81 citations · Full text

Engineering, Materials Engineering, Materials Science +14

Optimisation and integration of an active clamping circuit for IGBT series association

J. M. Saiz, Marie-Ange Mermet, David Frey et al. · 2002 · 74 citations

Engineering, Electrical Engineering, Circuit Theory +10