IEEE Design & Test of Computers · 2006 · 22 citations · 12 references
EngineeringComputer EngineeringSystems EngineeringEmbedded SystemsPackaging DesignSystem-on-chip DesignChip PackagingIntelligent PackagingMems PackagingMobile Device ArchitecturePackage DesignPackaging EngineeringAdvanced PackagingApplication PackagingComponent PackagingMobile Phone CommunicationPackaging System DesignPackaging SystemsSystem-in-packageSystem-in-package Integration
Engineers must make many cost-effective decisions during a product's design cycle. One challenge is deciding on the best packaging for their products. This article presents trade-offs among system-in-package, system-on-chip, and package-on-package integration for mobile phone applications
12
A discrete-time Bluetooth receiver in a 0.13μm digital CMOS process
K. Muhammad, Dirk Leipold, Y.-C. Ho et al. · 2004 · 111 citations
90nm low leakage SoC design techniques for wireless applications
Philippe Royannez, H. Mair, Franck Dahan et al. · 2005 · 100 citations
Engineering, Computer Engineering, Electrical Engineering +17