Concepedia

Component Packaging

Component Packaging is a systematic approach in vehicle development that integrates and optimizes the spatial arrangement, interface design, and functional compatibility of individual subsystems or parts within the overall architectural envelope to ensure feasible assembly, serviceability, and performance.

33

Publications

873

Citations

110

Authors

33

Institutions

Publications per year

2017–2026

3

Parents

Publications

33

Architectural issues in software reuse

Mary Shaw · 1995 · 119 citations

, , +15

IEEE Transactions on Components, Packaging, and Manufacturing Technology

IEEE Nanotechnology Magazine · 2015 · 68 citations

, , +14

Advanced low profile PoP solution with embedded wafer level PoP (eWLB-PoP) technology

Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin et al. · 2012 · 59 citations

, , +15

Optical components-the new challenge in packaging

M.R. Matthews, Brian Macdonald, K.R. Preston · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1990 · 55 citations

, , +17

An economic and environmental framework for analyzing globally sourced auto parts packaging system

Lai Jin, Al Harjati, Leon McGinnis et al. · Journal of Cleaner Production · 2008 · 48 citations

, , +14

1–5 of 33

Authors

110

  1. MS
    Mary Shaw

    Carnegie Mellon University, United States

    2 publications · 131 citations

    2

    h-index

  2. KU
    Kongpop U-yen

    Goddard Space Flight Center, United States

    2 publications · 22 citations

    2

    h-index

  3. EJ
    Edward J. Wollack

    Goddard Space Flight Center, United States

    2 publications · 22 citations

    2

    h-index

  4. DT
    David T. Chuss

    Goddard Space Flight Center, United States

    2 publications · 22 citations

    2

    h-index

  5. PL
    Pradeep Lall

    Auburn University, United States

    2 publications · 36 citations

    2

    h-index

1–5 of 110

Institutions

33

  1. Carnegie Mellon University

    Pittsburgh, United States

    3 h-index

    3 publications

    176 citations

  2. Software Engineering Institute

    Pittsburgh, United States

    2 h-index

    2 publications

    131 citations

  3. Fraunhofer Institute for Reliability and Microintegration

    Berlin, Germany

    2 h-index

    9 publications

    167 citations

  4. Georgia Institute of Technology

    Atlanta, United States

    2 h-index

    4 publications

    169 citations

  5. Auburn University

    Auburn, United States

    2 h-index

    10 publications

    196 citations

  6. Goddard Space Flight Center

    Greenbelt, United States

    2 h-index

    6 publications

    66 citations

  7. Technische Universität Berlin

    Berlin, Germany

    2 h-index

    8 publications

    190 citations

  8. Hong Kong University of Science and Technology

    Hong Kong, Hong Kong

    1 h-index

    2 publications

    24 citations

1–8 of 33

Venues

  1. 2010 IEEE MTT-S International Microwave Symposium

    Conference · 2 publications · 22 citations

    2

    h-index

  2. IEEE Nanotechnology Magazine

    1 publications · 68 citations

    1

    h-index

  3. IEEE Microwave Magazine

    1 publications · 13 citations

    1

    h-index

  4. IEEE Transactions on Magnetics

    1 publications · 19 citations

    1

    h-index

  5. SPE/EPA/DOE Exploration and Production Environmental Conference

    Conference · 1 publications · 10 citations

    1

    h-index

1–5