Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning

Interval estimation of process capability index c_pk

N.F. Zhang, Greg A. Stenback, Daniel M. Wardrop · Communication in Statistics- Theory and Methods · 1990 · 71 citations

Natural Sciences, Decision Sciences, Performance Measurement +16

Improving the wire bonding process quality using statistically designed experiments

Jiju Antony · Microelectronics Journal · 1999 · 44 citations

Engineering, Industrial Engineering, Manufacturing Engineering +15

Effect of wire diameter on the thermosonic bond reliability

Sarangapani Murali, Narasimalu Srikanth, Charles J. Vath · Microelectronics Reliability · 2005 · 38 citations

Natural Sciences, Materials Engineering, Materials Science +11

Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding

K.S. Goh, Z.W. Zhong · Microelectronic Engineering · 2006 · 28 citations

Engineering, Materials Engineering, Materials Science +6

Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding

Yu Hin Chan, Jang‐Kyo Kim, Deming Liu et al. · IEEE Transactions on Advanced Packaging · 2005 · 26 citations

Natural Sciences, Materials Engineering, Materials Science +16