Effect of wire diameter on the thermosonic bond reliability

Wire Bonding in Microelectronics

Jin Ok Yang · Assembly Automation · 2011 · 343 citations

Engineering, Electrical Engineering, Materials Science +12

Intermetallic formation in gold-aluminum systems

Elliott Philofsky · Solid-State Electronics · 1970 · 224 citations

Natural Sciences, Materials Engineering, Materials Science +13

An analysis of intermetallics formation of gold and copper ball bonding on thermal aging

S. Murali, Narasimalu Srikanth, Charles J. Vath · Materials Research Bulletin · 2003 · 122 citations

Natural Sciences, Materials Engineering, Materials Science +14

Interdiffusion in copper–aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation

H. T. G. Hentzell, R. D. Thompson, K. N. Tu · Journal of Applied Physics · 1983 · 57 citations

Natural Sciences, Materials Engineering, Materials Science +16

Interdiffusion in copper–aluminum thin film bilayers. II. Analysis of marker motion during sequential compound formation

H. T. G. Hentzell, K. N. Tu · Journal of Applied Physics · 1983 · 37 citations

Natural Sciences, Materials Engineering, Materials Science +17