J. Lee

Iterative optimization of tail breaking force of 1 mil wire thermosonic ball bonding processes and the influence of plasma cleaning

J. Lee, M. Mayer, Y. Zhou et al. · Microelectronics Journal · 2007 · 28 citations

Natural Sciences, Materials Engineering, Materials Science +13

Bonding wire characterization using automatic deformability measurement

C.J. Hang, I. Lum, J. Lee et al. · Microelectronic Engineering · 2008 · 27 citations

Natural Sciences, Materials Engineering, Materials Science +13

Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding Process

J. Lee, M. Mayer, Y. Zhou et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2009 · 17 citations

Natural Sciences, Manufacturing Engineering, Materials Engineering +11

Measurement of stress–strain behaviour of human hair fibres using optical techniques

J. Lee, Hyock‐Ju Kwon · International Journal of Cosmetic Science · 2012 · 12 citations

Natural Sciences, Biomedical Engineering, Materials Science +17