Concepedia

Plasma-activated Bonding

Plasma-Activated Bonding is a wafer bonding technique that enhances surface reactivity through plasma treatment to enable strong, direct adhesion between surfaces at low temperatures.

298

Publications

11.8K

Citations

1.2K

Authors

350

Institutions

Publications per year

2017–2026

103

Parents

Publications

298

Determining the optimal PDMS–PDMS bonding technique for microfluidic devices

Mark A. Eddings, Michael Johnson, Bruce K. Gale · Journal of Micromechanics and Microengineering · 2008 · 558 citations

, , +17

Magneto-optical isolator with silicon waveguides fabricated by direct bonding

Yuya Shoji, Tetsuya Mizumoto, Hideki Yokoi et al. · Applied Physics Letters · 2008 · 333 citations

, , +17

Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO[sub 2]

Tommi Suni, Kimmo Henttinen, I. Suni et al. · Journal of The Electrochemical Society · 2002 · 322 citations

, , +17

N2 Fixation by Plasma-Activated Processes

Lea R. Winter, Jingguang G. Chen · Joule · 2020 · 313 citations · Full text

, , +7

Plasma-assisted InP-to-Si low temperature wafer bonding

D. M. Pasquariello, Klas Hjort · IEEE Journal of Selected Topics in Quantum Electronics · 2002 · 244 citations

, , +17

1–5 of 298

Authors

1.2K

  1. TS
    Tadatomo Suga

    The University of Tokyo, Japan

    26 publications · 1.2K citations

    22

    h-index

  2. CW
    Chenxi Wang

    Harbin Institute of Technology, China

    14 publications · 626 citations

    14

    h-index

  3. EH
    Eiji Higurashi

    The University of Tokyo, Japan

    14 publications · 588 citations

    13

    h-index

  4. HT
    Hideki Takagi

    National Institute of Advanced Industrial Science and Technology, Japan

    10 publications · 394 citations

    10

    h-index

  5. MH
    M.M.R. Howlader

    The University of Tokyo, Japan

    10 publications · 286 citations

    10

    h-index

1–5 of 1.2K

Institutions

350

  1. The University of Tokyo

    Tokyo, Japan

    22 h-index

    81 publications

    4.4K citations

  2. McMaster University

    Hamilton, Canada

    11 h-index

    24 publications

    578 citations

  3. National Institute of Advanced Industrial Science and Technology

    Tsukuba, Japan

    11 h-index

    36 publications

    1.3K citations

  4. Nanyang Technological University

    Singapore, Singapore

    10 h-index

    33 publications

    900 citations

  5. Harbin Institute of Technology

    Harbin, China

    10 h-index

    57 publications

    2.1K citations

  6. Samsung (South Korea)

    Seoul, South Korea

    9 h-index

    54 publications

    1.3K citations

  7. EV Group (Austria)

    Sankt Florian am Inn, Austria

    7 h-index

    22 publications

    551 citations

  8. The University of Osaka

    Osaka, Japan

    6 h-index

    28 publications

    522 citations

1–8 of 350

Venues

  1. Japanese Journal of Applied Physics

    JJAP · 14 publications · 332 citations

    13

    h-index

  2. International Journal of Adhesion and Adhesives

    14 publications · 583 citations

    13

    h-index

  3. Surface and Coatings Technology

    12 publications · 459 citations

    12

    h-index

  4. Applied Surface Science

    12 publications · 372 citations

    12

    h-index

  5. ECS Transactions

    9 publications · 143 citations

    9

    h-index

1–5