Tommi Suni

Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO[sub 2]

Tommi Suni, Kimmo Henttinen, I. Suni et al. · Journal of The Electrochemical Society · 2002 · 316 citations

Engineering, Low-temperature Bonding, Integrated Circuits +16

Wafer-level SLID bonding for MEMS encapsulation

Heng Xu, Tommi Suni, Vesa Vuorinen et al. · Advances in Manufacturing · 2013 · 44 citations · Full text

Materials Science, Wafer Scale Processing, Engineering +6

MEMS on cavity-SOI wafers

Hannu Luoto, Kimmo Henttinen, Tommi Suni et al. · Solid-State Electronics · 2007 · 31 citations

Cavity-soi Wafers, Wafer Scale Processing, Engineering +6

Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding

Tommi Suni, Kimmo Henttinen, Antti Lipsanen et al. · Journal of The Electrochemical Society · 2005 · 23 citations

Mems Devices, Engineering, Plasma Processing +16

A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$W RTC Mode and Programmable HF Clocks

David Ruffieux, Nicola Scolari, Frédéric Giroud et al. · IEEE Journal of Solid-State Circuits · 2013 · 19 citations

Engineering, Vlsi Design, Computer Architecture +18