Tommi Suni - Concepedia

Author

Tommi Suni

VTT Technical Research Centre of Finland

Also Known As

T. Suni, Tommi Suni

Publications

709

Citations

H-Index

Concepts

All Affiliations

VTT Technical Research Centre of Finland Tieto (Finland)University of California San Diego Okmetic (Finland)Los Alamos National Laboratory

About

Tommi Suni is an author at VTT Technical Research Centre of Finland specializing in engineering, applied physics, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	11	13	544
2	Applied Physics	10	10	471
3	Computer Engineering	2	2	29
4	Chemical Engineering	1	1	316
5	Chemistry	1	1	316

Tommi Suni

Publications

586

Citations

H-Index

Page 1

	Year	Citations
Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO[sub 2] Tommi Suni, Kimmo Henttinen, I. Suni, Journal of The Electrochemical Society EngineeringLow-temperature BondingIntegrated CircuitsChemistryPlasma Activation	2002	316
Wafer-level SLID bonding for MEMS encapsulation Heng Xu, Tommi Suni, Vesa Vuorinen, Advances in Manufacturing Materials ScienceWafer Scale ProcessingEngineeringAdvanced Packaging (Semiconductors)Microfabrication	2013	44
MEMS on cavity-SOI wafers Hannu Luoto, Kimmo Henttinen, Tommi Suni, Solid-State Electronics Cavity-soi WafersWafer Scale ProcessingEngineeringMicrofabricationApplied Physics	2007	31
Wafer Scale Packaging of MEMS by Using Plasma-Activated Wafer Bonding Tommi Suni, Kimmo Henttinen, Antti Lipsanen, Journal of The Electrochemical Society Mems DevicesEngineeringPlasma ProcessingMicro-electromechanical SystemWafer Scale Processing	2005	23
A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub-$\mu$W RTC Mode and Programmable HF Clocks David Ruffieux, Nicola Scolari, Frédéric Giroud, IEEE Journal of Solid-State Circuits EngineeringVlsi DesignComputer ArchitectureIntegrated CircuitsMicro-electromechanical System	2013	19
Comparison of thermally and mechanically induced Si layer transfer in hydrogen-implanted Si wafers T. Höchbauer, Amit Misra, M. Nastasi, Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms Electrical EngineeringWafer Scale ProcessingEngineeringSurface ScienceApplied Physics	2003	18
Direct wafer bonding for MEMS and microelectronics Tommi Suni Aaltodoc (Aalto University)	2006	18
Cold ion-cutting of hydrogen implanted Si Kimmo Henttinen, Tommi Suni, A. Nurmela, Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms Materials ScienceIon ImplantationEngineeringMicrofabricationApplied Physics	2002	16
Reducing stiction in microelectromechanical systems by rough nanometer-scale films grown by atomic layer deposition Riikka L. Puurunen, Ari Häärä, Heini Saloniemi, Sensors and Actuators A Physical Materials ScienceEngineeringMicrofabricationNanotechnologySurface Science	2012	15
Silicon-on-Insulator Wafers with Buried Cavities Tommi Suni, Kimmo Henttinen, James Dekker, Journal of The Electrochemical Society Materials EngineeringMaterials ScienceElectrical EngineeringWafer Scale ProcessingEngineering	2006	14

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