Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding

Atmospheric pollution profiles in Mexico City in two different seasons

V. Altúzar, S. A. Tomás, O. Zelaya-Ángel et al. · Review of Scientific Instruments · 2003 · 459 citations

Natural Sciences, Environmental Sciences, Air Pollution +16

The Development of Cu Bonding Wire With Oxidation-Resistant Metal Coating

Shingo Kaimori, Takamasa Nonaka, Akira Mizoguchi · IEEE Transactions on Advanced Packaging · 2006 · 114 citations

Natural Sciences, Materials Engineering, Materials Science +16

New observations on intermetallic compound formation in gold ball bonds: general growth patterns and identification of two forms of Au4Al

C.D. Breach, F. Wulff · Microelectronics Reliability · 2004 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +13

Corrosion inhibition by self-assembled monolayers for enhanced wire bonding on Cu surfaces

Caroline M. Whelan, Michael Kinsella, L. Carbonell et al. · Microelectronic Engineering · 2003 · 110 citations

Natural Sciences, Materials Engineering, Materials Science +17

Mechanical reliability of Au and Cu wire bonds to Al, Ni/Au and Ni/Pd/Au capped Cu bond pads

Petar Ratchev, Serguei Stoukatch, Bart Swinnen · Microelectronics Reliability · 2005 · 98 citations

Natural Sciences, Materials Engineering, Materials Science +12