IEEE Journal of Solid-State Circuits · 2002 · 24 citations · 7 references
Hardware SecurityNon-volatile MemoryElectrical EngineeringChip SizeEngineeringFlash MemoryComputer EngineeringComputer ArchitectureSemiconductor Memory10-Mbyte/s Program Speed125-Mm/sup 2/Page SizeMicroelectronicsGarbage CollectionMemory Architecture
A single 3-V only, 1-Gb NAND flash memory has been successfully developed. The chip has been fabricated using 0.13-/spl mu/m CMOS STI technology. The effective cell size including the select transistors is 0.077 /spl mu/m/sup 2/. To decrease the chip size, a new architecture is introduced. The in-series connected memory cells are increased from 16 to 32. Furthermore, as many as 16 k memory cells are connected to the same wordline. As a result, the chip size is decreased by 15%. A very small die size of 125 mm/sup 2/ and an excellent cell area efficiency of 70% are achieved. As for the performance, a very fast programming and serial read are realized. The highest program throughput ever of 10.6-MByte/s is realized: 1) by quadrupling the page size and 2) by newly introducing a write cache. In addition, the garbage collection is accelerated to 9.4-MByte/s. In addition, the write cache accelerates the serial read operation and a very fast 20-MByte/s read throughput is realized.
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New ultra high density EPROM and flash EEPROM with NAND structure cell
F. Masuoka, M. Momodom, Yoichi Iwata et al. · 1987 · 180 citations
Non-volatile Memory, Engineering, Emerging Memory Technology +19
Tomoharu Tanaka, Yasunori Tanaka, Hiroki Nakamura et al. · IEEE Journal of Solid-State Circuits · 1994 · 85 citations
Non-volatile Memory, Shielded Bitline Architecture, Engineering +16
A reliable bi-polarity write/erase technology in flash EEPROMs
S. Aritome, R. Shirota, R. Kirisawa et al. · 2002 · 45 citations
Non-volatile Memory, Engineering, Emerging Memory Technology +17