Concepedia

Die Architecture

Die Architecture is a foundational structural framework within solid-state drive design that defines the organization, interconnection, and functional layout of individual NAND flash memory dies, distinguishing it from other architectural levels by its focus on die-level integration, resource allocation, and data management.

185

Publications

7.6K

Citations

1.5K

Authors

131

Institutions

Publications per year

2017–2026

27

Parents

Publications

185

Die Stacking (3D) Microarchitecture

Bryan Black, Daniel Pantuso, Paul A. Reed et al. · 2006 · 599 citations

, , +17

A 3.3 V 32 Mb NAND flash memory with incremental step pulse programming scheme

Kang-Deog Suh, Byung-Hoon Suh, Young-Ho Lim et al. · IEEE Journal of Solid-State Circuits · 1995 · 514 citations

, , +13

HBM (High Bandwidth Memory) DRAM Technology and Architecture

Hong-Shin Jun, Jin-Hee Cho, Kangseol Lee et al. · 2017 · 244 citations

, , +17

Exploring and Exploiting the Multilevel Parallelism Inside SSDs for Improved Performance and Endurance

Yang Hu, Hong Jiang, Dan Feng et al. · IEEE Transactions on Computers · 2012 · 184 citations

, , +15

New ultra high density EPROM and flash EEPROM with NAND structure cell

F. Masuoka, M. Momodom, Yoichi Iwata et al. · 1987 · 183 citations

, , +14

1–5 of 185

Authors

1.5K

  1. EJ
    Erik Jan Marinissen

    IMEC, Belgium

    9 publications · 428 citations

    9

    h-index

  2. AN
    A. Nitayama

    Toshiba (Japan), Japan

    6 publications · 147 citations

    6

    h-index

  3. FM
    F. Masuoka

    Toshiba (Japan), Japan

    5 publications · 264 citations

    5

    h-index

  4. TO
    Takashi Ohsawa

    Toshiba (Japan), Japan

    5 publications · 123 citations

    5

    h-index

  5. CC
    Chun‐Chuan Chi

    National Tsing Hua University, Taiwan

    5 publications · 165 citations

    5

    h-index

1–5 of 1.5K

Institutions

131

  1. Toshiba (Japan)

    Tokyo, Japan

    18 h-index

    208 publications

    8K citations

  2. Samsung (South Korea)

    Seoul, South Korea

    16 h-index

    307 publications

    13.9K citations

  3. Intel (United States)

    Santa Clara, United States

    14 h-index

    145 publications

    13.5K citations

  4. IMEC

    Leuven, Belgium

    10 h-index

    26 publications

    887 citations

  5. National Tsing Hua University

    Hsinchu, Taiwan

    7 h-index

    15 publications

    523 citations

  6. STMicroelectronics (Italy)

    Milan, Italy

    6 h-index

    43 publications

    779 citations

  7. Micron (United States)

    Boise, United States

    6 h-index

    131 publications

    5.7K citations

  8. Micron (Italy)

    Agrate Brianza, Italy

    5 h-index

    60 publications

    2.5K citations

1–8 of 131

Venues

  1. IEEE Journal of Solid-State Circuits

    21 publications · 1.3K citations

    16

    h-index

  2. Journal of Materials Processing Technology

    6 publications · 235 citations

    6

    h-index

  3. IEEE Transactions on Nuclear Science

    3 publications · 151 citations

    3

    h-index

  4. 3

    h-index

  5. Russian Microelectronics

    2 publications · 42 citations

    2

    h-index

1–5