Daniel Pantuso

Die Stacking (3D) Microarchitecture

Bryan Black, Daniel Pantuso, Paul A. Reed et al. · 2006 · 599 citations

Engineering, Computer Engineering, Computer Science +17

Foveros: 3D Integration and the use of Face-to-Face Chip Stacking for Logic Devices

D. Ingerly, Sally Safwat Amin, L. Aryasomayajula et al. · 2019 · 154 citations

Engineering, Computer Engineering, Embedded Systems +16

Cross-sectional nanoindentation: a new technique for thin film interfacial adhesion characterization

J.M. Sánchez, Safaa El-Mansy, Benyuan Sun et al. · Acta Materialia · 1999 · 132 citations

Natural Sciences, Materials Engineering, Materials Science +13

A formulation of the MITC4 shell element for finite strain elasto-plastic analysis

Eduardo N. Dvorkin, Daniel Pantuso, E.A. Repetto · Computer Methods in Applied Mechanics and Engineering · 1995 · 91 citations

Engineering, Computational Engineering, Mechanical Engineering +14

A finite element procedure for the analysis of thermo-mechanical solids in contact

Daniel Pantuso, Klaus‐Jürgen Bathe, Pavel A. Bouzinov · Computers & Structures · 2000 · 90 citations · Full text

Engineering, Materials Engineering, Mechanical Engineering +14