Chun‐Chuan Chi

3D DfT architecture for pre-bond and post-bond testing

Erik Jan Marinissen, Chun‐Chuan Chi, Jouke Verbree et al. · 2010 · 65 citations

Engineering, 3D-sic Test Flow, Dft Architecture +22

Post-bond testing of 2.5D-SICs and 3D-SICs containing a passive silicon interposer base

Chun‐Chuan Chi, Erik Jan Marinissen, Sandeep Goel et al. · 2011 · 50 citations

A DfT Architecture for 3D-SICs Based on a Standardizable Die Wrapper

Erik Jan Marinissen, Chun‐Chuan Chi, Mario Konijnenburg et al. · Journal of Electronic Testing · 2011 · 42 citations · Full text

3D-IC interconnect test, diagnosis, and repair

Chun‐Chuan Chi, Cheng‐Wen Wu, Min-Jer Wang et al. · 2013 · 41 citations

3D-ic Yield, 3D Ic Architecture, Electrical Engineering +13

DfT Architecture for 3D-SICs with Multiple Towers

Chun‐Chuan Chi, Erik Jan Marinissen, Sandeep Goel et al. · 2011 · 30 citations

Engineering, Dft Architecture, Computer Architecture +20