IEEE Electron Device Letters · 2006 · 110 citations · 7 references
EngineeringElectrical EngineeringMaterials EngineeringMicroelectronicsSemiconductor DevicesSemiconductor MaterialsCarrier TransportHigh-frequency Semiconductor DevicesSemiconductor HeterostructuresSemiconductor PhysicsWide-bandgap Semiconductor DevicesWide-bandgap SemiconductorsCurrent DensityCurrent GainCutoff FrequencyElectron DensityHeterostructure Field-effect TransistorsHeterostructure TransistorsPassivationTransconductance
The authors fabricated SiN/AlN/GaN metal-insulator-semiconductor heterostructure field-effect transistors (MIS-HFETs) using SiN passivation by catalytic chemical vapor deposition (Cat-CVD). Cat-CVD SiN increased the electron density of AlN/GaN HFETs by compensating the surface depletion of the two-dimensional electron gas. The MIS-HFETs had a maximum drain current density of 0.95 A/mm and a peak extrinsic transconductance of 211 mS/mm. A current-gain cutoff frequency of 107 GHz and maximum oscillation frequency of 171 GHz were obtained for the 60- and 70-nm-gate devices, respectively
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Low interface state density AlN/GaN MISFETs
E. Alekseev, A. Eisenbach, D. Pavlidis · Electronics Letters · 1999 · 63 citations
Masataka Higashiwaki, Norio Onojima, Toshiaki Matsui et al. · Journal of Applied Physics · 2006 · 47 citations