IEEE Transactions on Components and Packaging Technologies · 2000 · 39 citations · 3 references
EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsJoiningMechanical Behavior Of MaterialsAdhesive BondingChip PackagingThin Film AdhesionWafer BondingElectronics Thermal PackagingFlip-chip BondingFlip-chip BumpingJoint ReliabilityStrain-level VariationThermal CyclingThermal Strain DevelopmentThermo-mechanical Stress
Flip chip joining using anisotropically conductive adhesive (ACA) has become a very attractive technique for electronics packaging. Many factors can influence the reliability of the ACA flip-chip joint. Bump height, is one of these factors. In this work, the strain development during the thermal cycling test of flip-chip joining with different bump heights was studied. The effect of bump height is significant in the interface between the bumps and the pads. Bigger volume area of high strain is found for higher bump in the interface between the bumps and the pads. Our calculations show that there is practically no effect of the bump height on the strain variation in the bumps and in the pads.
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