Electronics Thermal Packaging is a systematic framework within thermal management engineering that integrates materials, interfaces, and geometric configurations to enhance heat dissipation from electronic devices by optimizing thermal resistance pathways between heat-generating components and their surrounding environment.
416
Publications
16K
Citations
1.6K
Authors
407
Institutions
Publications per year
2017–2026
92
Parents
Publications
416
1–5 of 416
Authors
1.6K
- AB
10
h-index
- JH
6
h-index
- MM
6
h-index
- JL
6
h-index
- GL
5
h-index
1–5 of 1.6K
Institutions
407
IBM (United States)
Armonk, United States
13 h-index
42 publications
1.6K citations
Motorola (United States)
Schaumburg, United States
12 h-index
29 publications
1.3K citations
Georgia Institute of Technology
Atlanta, United States
11 h-index
32 publications
1.4K citations
University of Maryland, College Park
College Park, United States
9 h-index
18 publications
608 citations
Xi'an Jiaotong University
Xi'an, China
9 h-index
28 publications
2.2K citations
Intel (United States)
Santa Clara, United States
7 h-index
16 publications
209 citations
Huazhong University of Science and Technology
Wuhan, China
7 h-index
31 publications
1.4K citations
Infineon Technologies (Germany)
Munich, Germany
7 h-index
17 publications
429 citations
1–8 of 407
Venues
- Applied Thermal Engineering
21 publications · 1.2K citations
18
h-index
- Microelectronics Reliability
17 publications · 503 citations
14
h-index
- IEEE Transactions on Components and Packaging Technologies
15 publications · 908 citations
14
h-index
- Journal of Electronic Packaging
15 publications · 571 citations
13
h-index
- IEEE Transactions on Components Hybrids and Manufacturing Technology
15 publications · 485 citations
13
h-index
1–5