Publication | Closed Access
Advances in composite materials for thermal management in electronic packaging
352
Citations
5
References
1998
Year
Advanced PackagingMaterials ScienceEngineeringThermal ProtectionComposite MaterialsMechanical EngineeringHeat TransferElectronic PackagingThermal EngineeringThermal ConductivityThermal Property
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|---|---|---|
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