Concepedia

Thermal-aware Electronics Packaging

Thermal-Aware Electronics Packaging is a method in small satellite design that integrates thermal management considerations into the physical arrangement and material selection of electronic components to ensure operational reliability under extreme thermal environments in space.

92

Publications

3.7K

Citations

357

Authors

120

Institutions

Publications per year

2017–2026

20

Parents

Publications

92

Advances in composite materials for thermal management in electronic packaging

Carl Zweben · JOM · 1998 · 357 citations

, , +16

Thermal effects in packaging high power light emitting diode arrays

Adam Christensen, Samuel Graham · Applied Thermal Engineering · 2008 · 309 citations

, , +16

The effect of thermal contact resistance on heat management in the electronic packaging

M. Grujičić, Changtai Zhao, E. C. Dusel · Applied Surface Science · 2004 · 255 citations

, , +16

Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite

Qinlong Ren, Penghua Guo, Jianjun Zhu · International Journal of Heat and Mass Transfer · 2020 · 187 citations

, , +15

Advanced thermal enhancement and management of LED packages

Chun-Jen Weng · International Communications in Heat and Mass Transfer · 2009 · 169 citations

, , +14

1–5 of 92

Authors

357

  1. HJ
    Hosung Jang

    Ulsan National Institute of Science and Technology, South Korea

    2 publications · 37 citations

    2

    h-index

  2. CB
    Chan Byon

    Yeungnam University, South Korea

    2 publications · 37 citations

    2

    h-index

  3. JL
    Johan Liu

    Chalmers University of Technology, Sweden

    2 publications · 38 citations

    2

    h-index

  4. XJ
    X. Jordà

    Institut de Microelectrònica de Barcelona, Spain

    2 publications · 53 citations

    2

    h-index

  5. GZ
    Georges Zissis

    Université Toulouse III - Paul Sabatier, France

    2 publications · 124 citations

    2

    h-index

1–5 of 357

Institutions

120

  1. Georgia Institute of Technology

    Atlanta, United States

    4 h-index

    8 publications

    728 citations

  2. Philips (Netherlands)

    Amsterdam, The Netherlands

    3 h-index

    6 publications

    134 citations

  3. Xi'an Jiaotong University

    Xi'an, China

    3 h-index

    5 publications

    691 citations

  4. Alcatel Lucent (Germany)

    Stuttgart, Germany

    2 h-index

    2 publications

    43 citations

  5. Hong Kong Polytechnic University

    Hong Kong, Hong Kong

    2 h-index

    5 publications

    401 citations

  6. IBM (United States)

    Armonk, United States

    2 h-index

    6 publications

    104 citations

  7. Laboratoire Plasma et Conversion d'Energie

    Toulouse, France

    2 h-index

    2 publications

    124 citations

  8. Smart High Tech (Sweden)

    Gothenburg, Sweden

    2 h-index

    2 publications

    38 citations

1–8 of 120

Venues

  1. Microelectronics Reliability

    8 publications · 226 citations

    8

    h-index

  2. Applied Thermal Engineering

    7 publications · 639 citations

    7

    h-index

  3. 4

    h-index

  4. JOM

    3 publications · 390 citations

    3

    h-index

  5. Journal of Electronic Packaging

    3 publications · 119 citations

    3

    h-index

1–5