Concepedia

R. Haug

RH

5

Publications

114

Citations

5

H-Index

1997

Active since

Affiliations

Robert Bosch (Germany)(Current)

Fraunhofer Institute for Manufacturing Technology and Advanced Materials

R. Haug is an author at Robert Bosch (Germany) specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingPolymer ScienceMicroelectronicsAdhesive MaterialsThermal EngineeringChemical EngineeringFlexible ElectronicsElectrical Insulation

Publications per year

1997–2018

5

Publications

5

Effect of bump height on the strain variation during the thermal cycling test of ACA flip-chip joints

K. Pinardi, Z. Lai, D. Vogel et al. · IEEE Transactions on Components and Packaging Technologies · 2000 · 39 citations

Engineering, Mechanical Engineering, Strain Variation +19

Effect of Joule heating on the reliability of solder joints under power cycling conditions

Jie Mei, R. Haug, Olivier Lanier et al. · Microelectronics Reliability · 2018 · 25 citations

Electrical Engineering, Engineering, Hardware Reliability +4

Current-induced degradation of isotropically conductive adhesives

S. Kotthaus, R. Haug, Hannes Schäfer et al. · 1997 · 22 citations

Materials Science, Isotropic Conductivity, Chemical Engineering +14

Current-induced degradation of isotropically conductive adhesives

S. Kotthaus, R. Haug, Hannes Schäfer et al. · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1998 · 18 citations

Materials Science, Isotropic Conductivity, Chemical Engineering +15

Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

R. Haug, R. Behner, C.-P. Czaya et al. · IEEE Transactions on Electronics Packaging Manufacturing · 2000 · 10 citations

Engineering, Mechanical Engineering, Solder Deposition +17

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