Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging

Abstract

This letter reports on techniques of full-wave extractions and analytical calculations to investigate the through-strata-via (TSV) parasitics in 3-D integration/packaging. Both methods suggest close TSV RLGC results over the entire frequency range of interest. A wideband SPICE model is generated from the TSV electromagnetic solutions with good agreement for both magnitudes and phases of return loss and insertion loss. Further sensitivity analysis results indicate that the isolation layer thickness weighs most in the signal gain at 20 GHz. This letter provides some insight to TSV electrical characteristics and helps TSV physical design to maximize the benefits of 3-D systems.