Jian‐Qiang Lu - Concepedia

Author

Jian‐Qiang Lu

Rensselaer Polytechnic Institute

Also Known As

J J Q Lu, Jian-Qiang Lu, Jian‐Qiang Lu

Publications

633

Citations

H-Index

Concepts

All Affiliations

Rensselaer Polytechnic Institute IBM Research - Thomas J. Watson Research Center IBM (United States)

About

Jian‐Qiang Lu is an author at Rensselaer Polytechnic Institute specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	15	579
2	Applied Physics	7	7	285
3	Computer Engineering	7	7	204
4	Natural Sciences	4	4	142
5	Chemistry	1	1	12

Jian‐Qiang Lu

Publications

579

Citations

H-Index

Page 1

	Year	Citations
Terahertz detector utilizing two-dimensional electronic fluid Jian‐Qiang Lu, M. S. Shur, Jeffrey L. Hesler, IEEE Electron Device Letters Thz PhotonicsElectrical EngineeringTerahertz DevicesTerahertz SpectroscopyEngineering	1998	132
High-Speed Design and Broadband Modeling of Through-Strata-Vias (TSVs) in 3D Integration Zheng Xu, Jian‐Qiang Lu IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringMechanical EngineeringComputer-aided DesignInterconnect (Integrated Circuits)Electromagnetic Compatibility	2011	95
Terahertz sources and detectors using two-dimensional electronic fluid in high electron-mobility transistors M. S. Shur, Jian‐Qiang Lu IEEE Transactions on Microwave Theory and Techniques EngineeringSubmillimeter RangePlasma ElectronicsRf SemiconductorNanoelectronics	2000	84
3D Power Delivery for Microprocessors and High-Performance ASICs Jian Sun, Jian‐Qiang Lu, David M. Giuliano, Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition EngineeringVlsi DesignEnergy EfficiencyComputer ArchitectureElectric Power Conversion	2007	68
Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network Zheng Xu, Adam Beece, Dingyou Zhang, Crosstalk MatricesElectrical EngineeringTsv Crosstalk PerformanceEngineeringAdvanced Packaging (Semiconductors)	2010	40
Architecture design exploration of three-dimensional (3D) integrated DRAM Rakesh Anigundi, Hongbin Sun, Jian‐Qiang Lu, 3D Ic ArchitectureDram ArchitectureEngineeringAdvanced Packaging (Semiconductors)Integrated Dynamic Ram	2009	22
Modeling of power delivery into 3D chips on silicon interposer Zheng Xu, Xiaoxiong Gu, M. Scheuermann, EngineeringPower Electronic SystemsPower ElectronicsInterconnect (Integrated Circuits)Physical Design (Electronics)	2012	21
Characterization and modeling of solder balls and through-strata-vias (TSVs) in 3D architecture Zheng Xu, Adam Beece, Dingyou Zhang, EngineeringComputer-aided DesignIntegrated CircuitsInterconnect (Integrated Circuits)Electromagnetic Compatibility	2010	20
Impacts of though-DRAM vias in 3D processor-DRAM integrated systems Qi Wu, K. Rose, Jian‐Qiang Lu, Hardware SecurityRegular Dram ArchitectureManycore Processor3D Ic ArchitectureEngineering	2009	17
Electromagnetic-SPICE modeling and analysis of 3D power network Zheng Xu, Jian‐Qiang Lu, Bucknell C. Webb, EngineeringOverall 3DElectrical PerformanceComputer-aided DesignPower Electronics	2011	16

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