Concepedia

Thermal Stress-Free Package for Flip-Chip Devices

M. Kohara, Muneo Hatta, H. Genjyo, Hajime Shibata, H. Nakata

IEEE Transactions on Components Hybrids and Manufacturing Technology · 1984 · 13 citations · 5 references

Concepts

EngineeringComputer EngineeringElectrical EngineeringHeat TransferMicroelectronicsSemiconductor DevicesChip PackagingDevice ReliabilityPackaging EngineeringSemiconductor ReliabilityThermal Properties Of MaterialsThermal StressesFlip-chip PackagingPackage ReliabilityPackage-level ReliabilityThermal Management In PackagingThermal Management Of Semiconductor DevicesThermal Reliability

Abstract

The purpose is to investigate the origin of technical progress as a result of the entropy law, to find its limitations, and to discover its best use.

References

5

Geometric Optimization of Controlled Collapse Interconnections

Lewis S. Goldmann · IBM Journal of Research and Development · 1969 · 175 citations

Engineering, Manufacturing Engineering, Design Optimization +14

Conduction Cooling for an LSI Package: A One-Dimensional Approach

Richard C. Chu, U. P. Hwang, Robert E. Simons · IBM Journal of Research and Development · 1982 · 97 citations

Engineering, Electrical Engineering, Mechanical Engineering +17

Lead-Indium for Controlled-Collapse Chip Joining

Lewis S. Goldmann, R. Herdzik, N. Koopman et al. · IEEE Transactions on Parts Hybrids and Packaging · 1977 · 33 citations

Engineering, Materials Engineering, Materials Science +16

Low Expansivity Organic Substrate for Flip-Chip Bonding

S. Greer · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1979 · 29 citations

Engineering, Materials Engineering, Materials Science +17

High Thermal Conduction Package Technology for Flip Chip Devices

M. Kohara, Shin Nakao, K. Tsutsumi et al. · IEEE Transactions on Components Hybrids and Manufacturing Technology · 1983 · 12 citations

Engineering, Electrical Engineering, Materials Science +17