Richard C. Chu - Concepedia

Author

Richard C. Chu

Poughkeepsie Public Library District

Also Known As

Chu, R. C., Chu, Richard C., R Chu, R. C. Chu, R.C. Chu, Richard C. Chu, Richard Chu, Ruoping Chu, Ruyin Chu

Publications

1.4K

Citations

H-Index

Concepts

All Affiliations

Poughkeepsie Public Library District IBM (United States)

About

Richard C. Chu is an author at Poughkeepsie Public Library District specializing in thermal engineering, heat transfer, and thermodynamics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	14	905
2	Applied Physics	4	4	95
3	Natural Sciences	1	1	115
4	Social Sciences	1	1	64
5	Biostatistics	1	1	115

Richard C. Chu

Publications

905

Citations

H-Index

Page 1

	Year	Citations
Review of Cooling Technologies for Computer Products Richard C. Chu, Robert E. Simons, Michael Ellsworth, IEEE Transactions on Device and Materials Reliability EngineeringLiquid Metal CoolingComputer ArchitectureDatacenter-scale ComputingRefrigeration	2004	247
Arsenic determination at submicrogram levels by arsine evolution and flameless atomic absorption spectrophotometric technique Richard C. Chu, G. P. Barron, Paul A. W. Baumgarner Analytical Chemistry EngineeringAtomic Emission SpectroscopyAltmetric Attention ScoreAbsorption SpectroscopyArsenic Determination	1972	115
Conduction Cooling for an LSI Package: A One-Dimensional Approach Richard C. Chu, U. P. Hwang, Robert E. Simons IBM Journal of Research and Development EngineeringLiquid Metal CoolingChip TiltIntegrated CircuitsRefrigeration	1982	97
An Assessment of Module Cooling Enhancement With Thermoelectric Coolers Robert E. Simons, Michael Ellsworth, Richard C. Chu Journal of Heat Transfer EngineeringEnergy EfficiencyThermoelectricsRefrigerationHeat Flux	2005	71
The evolution of water cooling for IBM large server systems: Back to the future Michael Ellsworth, Levi A. Campbell, Robert E. Simons, EngineeringLiquid Metal CoolingEnergy EfficiencyComputer ArchitectureSupercomputer Architecture	2008	69
The Challenges of Electronic Cooling: Past, Current and Future Richard C. Chu Journal of Electronic Packaging EngineeringLiquid Metal CoolingEnergy EfficiencyElectronic DesignComputer Architecture	2004	64
HEAT TRANSFER IN ELECTRONIC SYSTEMS Richard C. Chu Proceeding of International Heat Transfer Conference 8 Electrical EngineeringHeat Transfer ProcessEngineeringEnergy EfficiencyHeat Exchanger	1986	50
Maintaining Datacom Rack Inlet Air Temperatures With Water Cooled Heat Exchanger Roger Schmidt, Richard C. Chu, Mike Ellsworth, Energy HarvestingEngineeringAir ConditioningEnergy EfficiencyEnergy Management	2005	48
Experimental investigation of an enhanced thermosyphon heat loop for cooling of a high performance electronics module Richard C. Chu, Robert E. Simons, G. Chrysler EngineeringLiquid Metal CoolingHeat PipeForced ConvectionRefrigeration	2003	34
Jet impingement boiling of a dielectric coolant in narrow gaps G. Chrysler, Richard C. Chu, Robert E. Simons IEEE Transactions on Components Packaging and Manufacturing Technology Part A EngineeringPhysicsMicrofabricationDielectric CoolantMechanical Engineering	1995	31

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