Concepedia

U. P. Hwang

UP

3

Publications

169

Citations

3

H-Index

1981

Active since

Affiliations

IBM (United States)(Current)

U. P. Hwang is an author at IBM (United States) specializing in thermal engineering, electronic packaging, and electrical engineering.

Top concepts

Publications per year

1981–1992

3

Publications

3

Conduction Cooling for an LSI Package: A One-Dimensional Approach

Richard C. Chu, U. P. Hwang, Robert E. Simons · IBM Journal of Research and Development · 1982 · 97 citations

, , +19

Boiling heat transfer of silicon integrated circuits chip mounted on a substrate

U. P. Hwang, K. P. Moran · 1981 · 53 citations

, , +13

System cooling design for the water-cooled IBM Enterprise System/9000 processors

D. J. Delia, T. C. Gilgert, Neill Graham et al. · IBM Journal of Research and Development · 1992 · 19 citations

, , +19

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