Boiling heat transfer of silicon integrated circuits chip mounted on a substrate - Concepedia

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Boiling heat transfer of silicon integrated circuits chip mounted on a substrate

53

Citations

0

References

1981

Year

U. P. Hwang, K. P. Moran

Unknown Venue

Electrical EngineeringHeat Transfer ProcessEngineeringAdvanced Packaging (Semiconductors)MicrofabricationHeat Transfer EnhancementThermal ManagementChip AttachmentIntegrated CircuitsThermodynamicsElectronic PackagingHeat TransferMicroelectronicsThermal EngineeringCircuits ChipBoiling

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