IEEE Transactions on Electron Devices · 2005 · 206 citations · 9 references
EngineeringElectrical EngineeringMicroelectronicsNanotechnologySemiconductor DevicesDevice CharacterizationDevice ModelingDevice SimulationIntegrated Circuit DesignMetal-oxide-semiconductor Field-effect TransistorsNanoelectronicsCapacitanceDevice OptimizationFringe AnalysisGate Oxide Thickness EffectsNanoscale TransistorsPower ConsumptionPower Consumption OptimizationProcess Variation Analysis
We analyze the impact of gate electrode thickness and gate underlap on the fringe capacitance of nanoscale double-gate MOS (DGMOS) transistors. We propose an analytical fringe capacitance model considering gate underlap and finite source/drain length. A comparison with the simulation results show that the model can accurately estimate the fringe capacitance of the device. We show that an optimum gate underlap can significantly reduce the fringe capacitance resulting in higher performance and lower power consumption. Also, the effects of process variation in gate underlap devices are discussed. Simulation results on a three-stage ring oscillator show that with optimum gate underlap 32% improvement in delay can be achieved.
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Physical insights on design and modeling of nanoscale FinFETs
J.G. Fossum, M.M. Chowdhury, Vishal Trivedi et al. · 2004 · 105 citations