IEEE Transactions on Device and Materials Reliability · 2011 · 56 citations · 11 references
Device ModelingElectrical EngineeringPhysical Design (Electronics)EngineeringVlsi DesignAngled StrikesElectronic EngineeringBias Temperature InstabilityHeavy-ion DataSingle Event EffectsCharge CollectionMicroelectronicsMultiple-transistor Charge Collection
Heavy-ion data from a 130-nm bulk CMOS process shows a counterproductive result in using a common single-event charge collection mitigation technique. Guard bands, which are well contacts that surround individual transistors, can reduce single-event pulsewidths for normal strikes, but increase them for angled strikes. Calibrated 3-D TCAD mixed-mode modeling has identified a multiple-transistor charge collection mechanism that explains the experimental data, namely that angled strikes result in charge collection in the normally ON device that increases the restoring current on the struck device.
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V. Ferlet-Cavrois, Philippe Paillet, Dale McMorrow et al. · IEEE Transactions on Nuclear Science · 2007 · 151 citations
Electrical Engineering, Single Event Transients, Engineering +12