Development of an alkali-metal-free bath for electroless deposition of Co-W-P capping layers for copper interconnections

The Scherrer Formula for X-Ray Particle Size Determination

A. L. Patterson · Physical Review · 1939 · 8.9K citations

Engineering, Physics, Particle Physics +10

Relationship between interfacial adhesion and electromigration in Cu metallization

Michael Lane, E. Liniger, J. R. Lloyd · Journal of Applied Physics · 2003 · 294 citations

Natural Sciences, Electrical Engineering, Materials Science +13

Standardized terminology for oxide charges associated with thermally oxidized silicon

B. E. Deal · IEEE Transactions on Electron Devices · 1980 · 230 citations

Natural Sciences, Electrical Engineering, Materials Science +15

Selective and Blanket Electroless Copper Deposition for Ultralarge Scale Integration

Valery M. Dubin, Yosi Shacham‐Diamand, Bin Zhao et al. · Journal of The Electrochemical Society · 1997 · 197 citations

Natural Sciences, Materials Engineering, Materials Science +17

Barriers Against Copper Diffusion into Silicon and Drift Through Silicon Dioxide

Shi‐Qing Wang · MRS Bulletin · 1994 · 195 citations

Engineering, Materials Engineering, Materials Science +14