Electroplating

Electroplating is a faradaic coating process in which a conductive surface is selectively deposited with a metallic layer through the application of an electric current to drive the reduction of metal ions from an electrolyte solution, distinguishing it from other surface treatment or interconnect formation techniques by its reliance on electrochemical redox reactions.

1.4K

Publications

53.9K

Citations

5.3K

Authors

1.2K

Institutions

Publications per year

2017–2026

387

Authors

5.3K

  1. WD
    Wei‐Ping Dow

    National Chung Hsing University, Taiwan

    20 publications · 1.4K citations

    17

    h-index

  2. MS
    Masato Sone

    Tokyo Institute of Technology, Japan

    14 publications · 540 citations

    13

    h-index

  3. CW
    Chong Wang

    University of Electronic Science and Technology of China, China

    13 publications · 767 citations

    12

    h-index

  4. WH
    Wei He

    University of Electronic Science and Technology of China, China

    11 publications · 533 citations

    11

    h-index

  5. MA
    Maozhong An

    Harbin Institute of Technology, China

    11 publications · 589 citations

    11

    h-index

1–5 of 5.3K

Venues

  1. Journal of The Electrochemical Society

    JES · 117 publications · 4.6K citations

    37

    h-index

  2. Electrochimica Acta

    38 publications · 2.1K citations

    28

    h-index

  3. Surface and Coatings Technology

    43 publications · 2.1K citations

    28

    h-index

  4. Journal of Micromechanics and Microengineering

    JMM · 34 publications · 1.1K citations

    19

    h-index

  5. Transactions of the IMF

    31 publications · 715 citations

    17

    h-index

1–5