Chong Wang - Concepedia

Author

Chong Wang

University of Electronic Science and Technology of China ORCID

Also Known As

C. Wang, Chong WANG, Chong Wang, Frederik Bettels, W.L. Chong, Wang Chong, Wang, C., Wang, Chong

265

Publications

4.3K

Citations

H-Index

166

Concepts

All Affiliations

University of Electronic Science and Technology of China National Engineering Research Center of Electromagnetic Radiation Control Materials Chinese Academy of Sciences Harbin Institute of Technology University of Chinese Academy of Sciences

About

Chong Wang is an author at University of Electronic Science and Technology of China specializing in engineering, materials science, and electrochemistry.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	29	78	3.1K
2	Natural Sciences	5	5	121
3	Medicine	2	2	42
4	Social Sciences	2	2	42
5	Business	1	1	102

Chong Wang

109

Publications

Citations

H-Index

Page 1

	Year	Citations
Photo-Fenton Reaction of Graphene Oxide: A New Strategy to Prepare Graphene Quantum Dots for DNA Cleavage Xuejiao Zhou, Yan Zhang, Chong Wang, ACS Nano Materials ScienceGraphene NanomeshesChemical EngineeringGraphene Quantum DotEngineering	2012	523
Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison Chong Wang, Jinqiu Zhang, Peixia Yang, Electrochimica Acta Materials ScienceThrough-hole Copper ElectroplatingEngineeringElectrode-electrolyte InterfaceSurface Electrochemistry	2013	145
A comparison of typical additives for copper electroplating based on theoretical computation Zhiqiang Lai, Shouxu Wang, Chong Wang, Computational Materials Science Materials ScienceElectrometallurgyElectrical EngineeringTypical AdditivesEngineering	2018	110
Option pricing and coordination in the fresh produce supply chain with portfolio contracts Chong Wang, Xu Chen Annals of Operations Research EconomicsOption PricingInventory ManagementSupply Chain OptimizationPricing Policy	2016	102
Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition Yuanming Chen, Wei He, Xian‐Ming Chen, Electrochimica Acta Materials ScienceWafer Scale ProcessingEngineeringBeam LithographyMicrofabrication	2014	99
Efficiency improvement of flexible Sb2Se3 solar cells with non-toxic buffer layer via interface engineering Chong Wang, Shuaicheng Lu, Sen Li, Nano Energy Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Interface EngineeringApplied Physics	2020	99
Novel Dual-Ion Hybrid Supercapacitor Based on a NiCo<sub>2</sub>O<sub>4</sub> Nanowire Cathode and MoO<sub>2</sub>–C Nanofilm Anode Yuanyuan Li, Fan Tang, R. Wang, ACS Applied Materials & Interfaces	2016	98
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating Zhiqiang Lai, Shouxu Wang, Chong Wang, Electrochimica Acta Materials ScienceElectrometallurgyEngineeringComputational AnalysisAcid Copper	2018	95
A NiAl layered double hydroxide@carbon nanoparticles hybrid electrode for high-performance asymmetric supercapacitors Xiaoxi Liu, Chong Wang, Yibo Dou, Journal of Materials Chemistry A Materials ScienceSupercapacitorsChemical EngineeringEngineeringPorous Carbon	2013	90
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole Li Zheng, Wei He, Kai Zhu, Electrochimica Acta Materials Science4-Butanediol DiglycidylChemical EngineeringElectrometallurgyEngineering	2018	90

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